FINETECH
Offreur de technologies
Participant
Sylvain DULPHY
Responsable Commercial
- FINETECH
Description d'activité
Finetech is the sub-micron die bonding & assembly leading equipment manufacturer. Our machines are quick to set up and easy to operate, the system is ideal for fast and flexible product development and prototyping in R&D labs. Thanks to same architecture, transfer of development from manual to automatic machines is simple.
https://www.youtube.com/channel/UCCpsAgkub7mM5VaggY694IQ
VOS OFFRES
Description des offres
- MICRO & NANO ELECTRONIQUE
- Equipements et procédés microélectroniques (traitements de surface, fabrication front end, back end, test, caractérisation fonctionnelle , robustesse et fiabilité)
Précisions sur la nature des offres
Finetech manufactures innovative high-accuracy equipment for leading-edge sub-micron bonding, micro assembly and advanced rework challenges.
Finetech die bonders are applied in various industries, such as aerospace & avionics, consumer electronics, industrial semiconductor, automotive & transportation, datacom & telecom, defense & security, energy, medical technology & life sciences, as well as academic & scientific research, to support precise and complex applications: flip chip bonding, laser bars, photonics packaging, VCSELs, MEMS, sensors, chip to wafer, and many more. Available is a particularly wide spectrum of bonding technologies, including ultrasonic and thermocompression bonding, adhesive technologies, sinter bonding, laser-assisted die bonding and precision bonding in vacuum.
Finetech's "Prototype-to-Production" approach makes it possible to consider all future automation steps as early as the development stage and then transfer the development processes in all their technological diversity to the production environment with ease. This is possible due to a cross-system machine architecture, a unified process module platform, and identical software and operation.
www.finetech.de
VOS PRODUITS
Description du produit
FINEPLACER® lambda 2 is a sub-micron table-top die bonder with a placement accuracy of 0.5 µm and the ultimate tool for opto assemblies. The system can be easily configured for a wide range of applications for process development or prototyping.
Description du produit
FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.3 µm @ 3 sigma that offers unrivaled flexibility for prototyping & production environments. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protected from external influences, this automatic flip chip bonder stands for highly stable assembly processes with the focus on maximum yield.
Description du produit
Description du produit
VOS BESOINS
Description des besoins
- MICRO & NANO ELECTRONIQUE
- Composants « mémoire », micro processeurs et autres circuits intégrés (analogiques, numériques, mixtes analog&digital)
- Composants actifs (amplificateurs, antennes…) et passifs (condensateurs, inductances) RF, hyperfréquence, THz
- Composants pour l’énergie (Micro batteries, passifs, diodes et transistors de puissance…)
- Composants MEMS et NEMS, capteurs, actuateurs
- PCB, cartes électroniques (EMS)
- Intégration 3D (interposeurs électronique & micro fluidique, Wafer Level Packaging…)
- Solutions et systèmes électroniques
- Le quantique
- PHOTNIQUE
- Afficheurs et écrans
- Détecteurs / caméras / instruments d’imagerie
- Instruments d’optique/spectométrie
- Platines / moteurs / actionneurs piézo-electriques
- Eclairage / sources / lasers / LED / OLEDS
- Micro / nano optique, optique intégrée
- INTERACTIONS, CONTENUS ET USAGES
- Interfaces cérébrales et Neuro-technologies (brain-computer interface, emotiv headset…)