FINETECH
Technology provider
Sylvain DULPHY
Sales Manager
- FINETECH
Activity
Finetech is a leading manufacturer of equipment for leading-edge sub-micron bonding and micro assembly challenges. Finetech's bonders are suitable for R&D, lab, and prototype tasks. The company also offers automated systems for high-mix production with higher volumes. Our "Prototype-to-Production" approach allows for an easy transfer of development processes to the production environment.
YOUR OFFERS
Description of your offers
- MICRO & NANO ELECTRONIC
- Microelectronic equipment and processes (surface treatments, front end manufacturing, back end, test, functional characterization, robustness and reliability)
Specific information on the nature of the offer
Finetech manufactures innovative high-accuracy equipment for leading-edge sub-micron bonding, micro assembly and advanced rework challenges.
Finetech die bonders are applied in various industries, such as aerospace & avionics, consumer electronics, industrial semiconductor, automotive & transportation, datacom & telecom, defense & security, energy, medical technology & life sciences, as well as academic & scientific research, to support precise and complex applications: flip chip bonding, laser bars, photonics packaging, VCSELs, MEMS, sensors, chip to wafer, and many more. Available is a particularly wide spectrum of bonding technologies, including ultrasonic and thermocompression bonding, adhesive technologies, sinter bonding, laser-assisted die bonding and precision bonding in vacuum.
Finetech's "Prototype-to-Production" approach makes it possible to consider all future automation steps as early as the development stage and then transfer the development processes in all their technological diversity to the production environment with ease. This is possible due to a cross-system machine architecture, a unified process module platform, and identical software and operation.
www.finetech.de
YOUR PRODUCTS
Product description
FINEPLACER® lambda 2 is a sub-micron table-top die bonder with a placement accuracy of 0.5 µm and the ultimate tool for opto assemblies. The system can be easily configured for a wide range of applications for process development or prototyping.
Product description
FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.3 µm @ 3 sigma that offers unrivaled flexibility for prototyping & production environments. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protected from external influences, this automatic flip chip bonder stands for highly stable assembly processes with the focus on maximum yield.
Product description
Product description
YOUR NEEDS
Description of your needs
- MICRO & NANO ELECTRONIC
- Memory" components, micro-processors and other integrated circuits (analog, digital, mixed analog&digital)
- Active components (amplifiers, antennas...) and passive components (capacitors, inductors) RF, microwave, THz
- Components for energy (Micro batteries, passive, diodes and power transistors...)
- MEMS and NEMS components, sensors, actuators
- PCBs, electronic boards (EMS)
- 3D integration (electronic & micro-fluidic interposers, Wafer Level Packaging...)
- Electronic solutions and systems
- Quantum computing
- PHOTONICS
- Displays and screens
- Sensors/cameras/imaging instruments
- Optical/spectometric instruments
- Piezoelectric boards/motors/actuators
- Lighting/sources/lasers/LED/OLEDS
- Micro/nano optics, integrated optics
- INTERACTIONS, CONTENT AND USES
- Brain and Neuro-technology interfaces (brain-computer interface, emotiv headset...)