BPAURA
Bank & Investor
Marie SOUFFLOT
Innovation Manager
- BPAURA
Activity
La filière Innovation, NEXT INNOV propose un dispositif d’accompagnement spécialement dédié aux nouvelles problématiques des start-up et des entreprises établies innovantes. Dans chaque pôle NEXT INNOV, un ingénieur innovation travaille en binôme avec chacun des conseillers pour permettre une vision 360 à chacun des projets et apporter une analyse sur le BM, le marché, l’équipe et l’innovation.
What is your main objective of participation?
YOUR NEEDS
Your needs
- MICRO & NANO ELECTRONIC
- Design and modelling tools (CAD, EDA...)
- Materials (crystals, nanomaterials, raw materials for microelectronics...), advanced substrates
- Microelectronic equipment and processes (surface treatments, front end manufacturing, back end, test, functional characterization, robustness and reliability)
- Memory" components, micro-processors and other integrated circuits (analog, digital, mixed analog&digital)
- Active components (amplifiers, antennas...) and passive components (capacitors, inductors) RF, microwave, THz
- Components for energy (Micro batteries, passive, diodes and power transistors...)
- MEMS and NEMS components, sensors, actuators
- Hardware technologies for the security of electronic components and systems
- Packaging (Modelling, Hermetic and nonhermetic packaging, System In Package, Cryogenic packaging...) and 3D printing
- PCBs, electronic boards (EMS)
- 3D integration (electronic & micro-fluidic interposers, Wafer Level Packaging...)
- Organic, printed and large surface electronics
- Electronic solutions and systems
- Installation/maintenance of specialized infrastructures (clean rooms, anhydrous rooms, test rooms and carac...)
- Quantum computing
- AI ASIC, (AI Application Specific Integrated Circuits)
- AI specific electronic components
- Other: Micro-nano training (microelectronics, RF, power, digital transformation)...
- PHOTONICS
- Displays and screens
- Holography/diffractive optics
- Sensors/cameras/imaging instruments
- Optical/spectometric instruments
- Guided optics/optical fibers
- Piezoelectric boards/motors/actuators
- Thin films/materials
- Signal and image processing
- Lighting/sources/lasers/LED/OLEDS
- Micro/nano optics, integrated optics
- Simulation/modelling
- Others
- SOFTWARE
- Infrastructure (computer/Servers/Storage/Networks and Telecom, High Performance Computing)
- Simulation/Modelling
- Data (data processing, Big Data, Database)
- Internet of Things
- Artificial intelligence
- Software vendors (Business applications, Web & Mobile Application, Software tools, OpenSource)
- EmSOC (embedded software, industrial software, formal methods)
- Digital security
- Bloc Chain
- Robotics
- Others
- INTERACTIONS, CONTENT AND USES
- Interactive technologies (HMI, NUI, robotic interaction, no interface)
- Immersive technologies (AR/VR/MR/MR/Immersive rooms...)
- Sensory technologies (haptics, olfactory, sound...)
- Brain and Neuro-technology interfaces (brain-computer interface, emotiv headset...)
- Sound and voice technologies (digital lutherie, acoustic, vocal interfaces,...)
- Broadcasting and distribution of content
- Content creation technologies (VFX, game engine, texturing,...)
- Information, Communication & Datavisualisation (storytelling, indicators, charts, graphics, DPA...)
- Design (product, services, interfaces.....)
- Creativity (ideation, methodology, gamification...)
- Others
- ARTIFICAL INTELLIGENCE
- Learning Systems : Machine Learning, Deep Learning, Reinforcement Learning
- AI Enablers : AI Acceleration Hardware, AI platforms, Big Data Systems, Data Analytics, Data Science
- Intelligence Capabilities : Machine Vision & Sensing (Image recognition & Computer Vision, Audio & Video Analytics, Analytics & Predictions), Natural Language Processing (Natural Language, Understanding, Conversational Agents, Speech Synthesis), Acting & Automating (Augmented Creativitity, Autonomous Vehicles, Smart Automation), Prediction & Decision Making (Advanced Simulation, Prescriptive Modeling)
Specific information on the nature of the need
La Banque Populaire Auvergne Rhône Alpes, en partenariat avec le Fonds Européens d’Investissement (FEI) propose aux entreprises un dispositif unique de financement de l’innovation ; Innov&Plus. Les PME et ETI innovantes, quel que soit le type d’innovation (R&D, marketing, adaptation, process…) pourront prétendre à un prêt à un taux réduit grâce à la garantie partielle du FEI.